Features Stylish and compact Bluetooth speaker, easy to carry. Supports wireless connectivity via Bluetooth. True Wireless Stereo (TWS): Connect two speakers simultaneously. Durable ABS plastic material with a fabric-covered front panel. Built-in microphone for hands-free calls. LED indicator to display working status. Water-resistant with an IPX7 rating. Continuous playback for 8-12 hours (depending on volume). 5-watt speaker delivering Hi-Fi audio quality. On-speaker controls for music playback and volume adjustment. Built-in battery with Type-C charging port for easy recharging. Technical Specifications Bluetooth Version: V5.4 Transmission Distance: 10 meters Rated Power: 5W Driver Unit: 40mm Input: DC5V Battery Capacity: 1200mAh Charging Time: 2 hours Playback Time: 8-12 hours (depending on volume)
P.S: Ask for your Additional Discount when you buy additional Parts GIGABYTE B760 DS3H GIGABYTE B760 DS3H Motherboard enables the ultimate connection experience. with blazing data-transfer speeds through the next generation network and storage. GIGABYTE CONTROL CENTER (GCC) is a unified software for all GIGABYTE Unified software platform for all Gigabyte supported products Intuitive user interface for an eased experience Modularized control components only for installed hardware Auto update function to keep system up to date and support future products Multi-Key GIGABYTE B760 DS3H A multi-function reset button that can be to other function in BIOS for different user . RGB Switch Turn off all lighting effect on motherboard. Direct-To-BIOS Boot into BIOS menu directly without pressing any keyboard button. Safe Mode Boot into BIOS safe mode to change specific option without losing other BIOS settings. CPU LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors L3 cache varies with CPU (Please refer “CPU Support List” for more information.) Chipset Intel® B760 Express Chipset Memory Support for DDR5 5200(O.C.) / 4800 / 4000 MT/s memory modules 4 x DDR5 DIMM sockets supporting up to 192 GB (48 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to “Memory Support List” for more information.) Onboard Graphics Integrated Graphics Processor-Intel® HD Graphics support: 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz * Support for HDMI 2.0 version and HDCP 2.3. 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz * Support for DisplayPort 1.2 version and HDCP 2.3 (Graphics specifications may vary depending on CPU support. Specifications: Specifications CPU LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors L3 cache varies with CPU (Please refer “CPU Support List” for more information.) Chipset Intel® B760 Express Chipset Memory Support for DDR5 7600(O.C.) /7400(O.C.) /7200(O.C.) /7000(O.C.) /6800(O.C.) /6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules 4 x DDR5 DIMM sockets supporting up to 192 GB (48 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules 3 year warranty manufacturer link
Lenovo ThinkCentre Neo 30a-24 All in One 12B0009AEX i7-1260P Processor Intel Core i7-1260P, 12C (4P + 8E) / 16T, P-core 2.1 / 4.7GHz, E-core 1.5 / 3.4GHz, 18MB Graphics Integrated Intel Iris Xe Graphics Functions as UHD Graphics Chipset Intel SoC Platform Memory 1x 8GB SO-DIMM DDR4-3200 Memory Slots Two DDR4 SO-DIMM slots, dual-channel capable Max Memory Up to 16GB DDR4-3200 Storage 512GB SSD M.2 2280 PCIe 4.0×4 NVMe Opal 2.0 Storage Support For installing HDD storage, assembly kits are needed. The kits only come with HDD models. Up to two drives, 1x 2.5″ HDD + 1x M.2 SSD • 2.5″ HDD up to 1TB • M.2 SSD up to 1TB Optical DVD±RW Audio Chip High Definition (HD) Audio, Realtek ALC256 codec Speakers 3Wx2 Camera HD 720p Microphone 2x, Array Power Supply 90W 89% Adapter DESIGN Display 23.8″ FHD (1920×1080) IPS 250nits Anti-glare, 72% NTSC Touchscreen None Keyboard USB Calliope Keyboard, Black, Arabic Mouse USB Calliope Mouse, Black Expansion Slots Two M.2 slots (one for WLAN, one for SSD) Case Color Raven Black Stand Monitor Stand Form Factor AIO (23.8 inches) Dimensions (WxDxH) 541 x 185 x 433.6 mm (21.3 x 7.3 x 17.1 inches) Weight Around 6.7 kg (14.8 lbs) CONNECTIVITY Ethernet Integrated 100/1000M WLAN + Bluetooth Intel AX201, 11ax 2×2 + BT5.1 Front Ports None Rear Ports 2x USB 2.0 2x USB 3.2 Gen 2 1x HDMI-out 1x Ethernet (RJ-45) 1x power connector Left Ports None Optional Left Ports (configured) None Right Ports None Optional Right Ports (configured) None SECURITY & PRIVACY Security Chip Firmware TPM 2.0 integrated in SoC SERVICE Base Warranty 1-year, Courier or Carry-in Included Upgrade 2Y Courier/Carry-in upgrade from 1Y Courier/Carry-in (5WS0D81019) CERTIFICATIONS Green Certifications ErP Lot 3 and Lot 7 RoHS / WEEE / REACH Other Certifications TÜV Rheinland Flicker Free TÜV Rheinland Low Blue Light TÜV Rheinland Low Noise Specifications: Lenovo ThinkCentre Neo 30a-24 All in One 12B0009AEX i7-1260P Processor Intel Core i7-1260P, 12C (4P + 8E) / 16T, P-core 2.1 / 4.7GHz, E-core 1.5 / 3.4GHz, 18MB Graphics Integrated Intel Iris Xe Graphics Functions as UHD Graphics Chipset Intel SoC Platform Memory 1x 8GB SO-DIMM DDR4-3200 Memory Slots Two DDR4 SO-DIMM slots, dual-channel capable Max Memory Up to 16GB DDR4-3200 Storage 512GB SSD M.2 2280 PCIe 4.0×4 NVMe Opal 2.0 1 Year Warranty
SIMPLE, AFFORDABLE USB MODEM The USR® 56K* USB Softmodem delivers the performance and reliability USR is known for in a compact, cost effective form factor. Broadly compatible with Windows including 64 bit and server systems, the modem uses the CPU of the host computer for high compression throughput due to direct parallel access. Features include ring detection and qualification — eliminating unintended wake-on-ring events due to activity on the phone line other than ringing, as well as handling pulse dial control to eliminate system timing dependencies common with soft modems. The USR USB Softmodem is fully compatible with V.92 and lower rates, making it ideal for compact POS solutions that only require V.34. manufacturer link
“Epson LQ-590IIN Narrow/A4” “Dot Matrix printer: 24 pins, 80 column, Original + 4 copies, 440 cps HSD (10 cpi), Epson ESC/P2, IBM PPDS, 14 fonts, paper paths, single and continuous sheet, paper park. Connectivity: Parallel and USB interface, Ethernet interface (100 Base-TX / 10 Base-T).”
The Mars Gaming MCPU-VRW ARGB Heatsink is a powerful and stylish cooling solution for your CPU. It features a unique dual-mirror design with ARGB lighting, creating an infinite depth effect that enhances your PC’s look. This cooler supports CPUs with a TDP of up to 180W, making it suitable for gaming and high-performance tasks. It uses four efficient heatpipes and a large aluminum radiator to dissipate heat effectively. The 120mm fan operates between 800 and 1600 RPM, providing airflow from 29 to 67 CFM while maintaining low noise levels. With a noise range of 9 to 23 dBA, it ensures quiet operation even under load. The MCPU-VRW is compatible with a wide range of Intel and AMD sockets, including LGA 2066, 2011, 1700, 1200, 115x, and AM5, AM4, AM3+, AM3, AM2+, AM2, FM2, FM1. This universal compatibility makes it a versatile choice for various builds. ARGB lighting can be controlled via a 3-pin 5V connector, supporting systems like Asus Aura Sync, Mystic Light Sync, and RGB Fusion. You can customize the lighting to match your setup or let it run in automatic rainbow mode. The cooler’s dimensions are 130x74x151mm, and it weighs 505g, fitting comfortably in most standard cases. It includes thermal paste and mounting brackets for easy installation. Whether you’re building a new PC or upgrading your current one, the Mars Gaming MCPU-VRW ARGB Heatsink offers efficient cooling and stunning visuals. Specifications: Weight : 505g Socket : INTEL LGA 2066/2011/1851/1700/1200/1156/1155/1151/1150/1366 y AMD AM5/AM4/AM3+/AM3/AM2+/AM2/FM2/FM1 Speed : 800-1600 ± 10% RPM Fan : 120x25mm Airflow : 29-67 CFM TDP : 180W
OEM-quality trackpad replacement (without flex cable) for MacBook Pro 13″ (Models A2251 and A2289, 2020) in Silver finish—engineered for precise Force Touch response, smooth multi-touch gestures, and seamless integration with the original chassis. Compatible With: MacBook Pro 13″ (2020, Two Thunderbolt Ports) – Model A2251 (Intel Core i5/i7) MacBook Pro 13″ (2020, Four Thunderbolt Ports) – Model A2289 (Intel Core i5/i7) (Note: Both models share the same trackpad assembly despite port differences.) MacBook Pro 13″ (2020, Two Thunderbolt Ports) – Model A2251 (Intel Core i5/i7) MacBook Pro 13″ (2020, Four Thunderbolt Ports) – Model A2289 (Intel Core i5/i7) (Note: Both models share the same trackpad assembly despite port differences.) Part Type: Trackpad only—does not include the flex cable, Taptic Engine, or mounting hardware. Designed for technicians who will reuse the original internal components. Finish: Silver—matches the Silver MacBook Pro 13″ top and bottom case for perfect aesthetic continuity. Force Touch Support: Fully compatible with pressure-sensitive input and haptic feedback when paired with the original Taptic Engine and logic board—ensuring full macOS gesture functionality (e.g., Force Click, Lookup, Pressure-sensitive drawing). Precision Build: Features the same glass surface texture, curvature, and micro-click mechanism as Apple’s original—delivering consistent tracking accuracy and tactile feel. Installation Requirements: Requires full bottom case disassembly and careful transfer of the original flex cable and Taptic Engine. Adhesive must be applied precisely to maintain structural rigidity and sensor alignment. Recommended for certified or experienced repair technicians only.
Thermal Grizzly Minus Pad 8 Thermal Pad 120x20mmx1mm Model TG-MP8-120-20-10-1R Features: The high performance thermal pads of the Thermal Grizzly Minus Pad series consist of a very elastic and flexible surface area with very high thermal conductivity, compensating for even the smallest of gaps between components. Available in a variety of different sizes and thicknesses. High thermal conductivity High compressibility Electrical insulation Specs: Specifications minus pad 8: W/mK 8.0, temperature range: -100°C / +250°C The minus pads 8 are available in the sizes of 30x30mm, 120x20mm, 100x100mm as well as in the thicknesses of 0,5mm, 1mm, 1,5mm, 2mm.
